Fields of application

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Solder paste

PF305-133TO ●Ensures wettability by using non-halogen activator ●Soldering properties equivalent to those of conventional halogen types
PF305-140TO ●Excellent void reduction effect with halogen free benefits ●Maintains an excellent heating prevention effect
PF305-150TO(A) ●Ｒeducing void generation in large area printing even at air atmosphere ●Good wettability even on oxidized substrates at air reflow ● Less solder bridges and less solder balls due to good wettability
PF305-153TO ●Available fine BGA mounting thanks to fine printability and Solubility
PF305-117TO(TF) ●Good wettability despite halogen-free flux ●Maintains an excellent heat slumping prevention effect
PF305-V302TO ●Excellent void reduction effect regardless of reflow condition ●Improved wettability for nickel platings and fewer voids ●Applicable to bond large areas such as those of power semiconductors ●Cleanable with various types of cleaning liquids
PF305-92MVO ●Forms bumps via the solder paste printing method, without using any special equipment　 Applicable with conventional SMT surface mount facilities ●Available for forming bumps or precoating
207S series for dispensers ●Stable discharging performance ●Offering various types of syringe containers

Conductive adhesive
Epoxy silver paste: ECA100, 151, 170 ●ECA100 series is silver epoxy conductive adhesive of one-component. ●Our product line up includes [ECA-100] with the "excellent workability of a one-component adhesive" and "both low-temperature curing and room-temperature storage" and [ECA-151] with the benefits of a "one-component adhesive with a focus on workability", "a super long pot life", and, "room-temperature storage for 3 months". Epoxy nickel paste: ECA202 ●ECA202 is nickel epoxy conductive adhesive of one-component. ●Compatible both low temperature curing and storage stability at the normal temperature. ●Actualizes low cost due to the use of nickel. ●Stable conductivity even with tin electrode.