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●Usage: die bond for power devices, semiconductor IC, sealing package
●Shape: pellet (disc, square), tape, wire
●Characteristics
・Uses high-purity alloy which minimizes impurities
・Vacuum degassing process named 'DG Method' enables to eliminate dissolved gas from Pb-solders, which is
one of the causes for void formation
・Ensures excellent wettability without any taint, oil content, oxidized material, or scratches on the surface
・Smooth and no sticking of solders
・Embossed tape package available for the pellet types
・Proven track record for in-vehicle equipment, industrial equipment, and other fields requiring high reliability
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