Pb-free Solder Paste for SMT
Released a new solder paste
overcome head in pillow defect in BGA package
PF305-153TO
Alloy Composition : Sn-3.0Ag-0.5Cu
Flux : Halogen Free, ROL0 in IPC standards
Available fine BGA mounting thanks to fine printability and Solubility
Secured fine printability and fine solubility required for BGA package
Fine solubility even at air reflow
| 【Test board】 | 【Reflow condition】 | |
| ・Substrate : FR-4 | ・Air reflowing | |
| ・Mask : 0.2mmΦ and 0.12mmT | ・Preheating 100sec at 180 to 190℃ | |
| ・Peak temp. 240℃, 26sec for 220℃ |
The mechanism how head in pillow defect occurs in BGA package
Schematic diagram of head in pillow defect caused by warpage in the package
Improved wettability with maintaining strong activity despite halogen free
153TO
