Highly reliable Pb-free solder paste for SMT Patent No. 6370458
PF332C-150TO(A8)
・ Realized low void suitable for automotive application
・ Adaptable same reflow profile with SAC305’s
・ Prevents occurrence of chip-side balls
Highly suppressed void on back electrodes
Effective to back electrodes indispensable to prevent void occurrence
Prevent occurrence of chip-side balls
Prevent to occur chip-side balls even at excessive soldering volume
150A8
